ATP now offers this same unique cost effective backside metal to all of our customers wishing to attach substrates with epoxies without experiencing the usual problems, such as substrates not adhering, lifting during or after temperature shock and temperature cycling. This metallization scheme when used and applied as directed will result in superior adhesions in comparison to conventional type processes thus eliminating the age old headaches of pre-scoring or roughing up the surface of the substrate before attaching.
ATP has developed two types of backside metallization to optimize adhesion utilizing both paste and film epoxy applications allowing our customers to attach directly to aluminum, copper, brass and kovar housing to minimize size and weight of the assembly. Contact ATP for further information on this unique backside metal or to request samples. We are very interested in discussing your individual application process and product needs. – less – More from ZoomInfo »