Pros: great place to work
Cons: project delays, cancellations, insecurity
Managed development of a new product, holding timely Product design reviews; wafer Fab; bump Fab; flip chip assembly; package development; assembly; test and burnin.
•Coordinated development of new technologies between Worldwide teams in India, USA (CA,/AZ), and France and implemented the development in wafer fab in France.
Good working environment, lot of freedom to work on the projects.
Hardest part of the job was everything had to be approved by VP in France.