Metallization Process Engineer
College of Nanoscale Science and Engineering - Albany, NY

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The Metallization Process Engineer duties will include, but not be limited to: work in CNSE’s 300mm semiconductor development facilities with responsibilities including Cu and W deposition process development, evaluation, and characterization at the 32 nanometer technology node and beyond.

Additional duties will include: hands-on operation of all metallization equipment; mentoring and training the technician staff; writing/updating operating procedures and specifications; internal and external customer applications support; and coordination of new equipment qualification. The successful applicant must be able to interface effectively with fab operations, process maintenance, and semiconductor engineering professionals from client companies; develop and characterize processes compatible with advanced metallization technologies, including electroplating, electroless plating, and contact metallization; must use effective troubleshooting skills to solve process problems.

The successful candidate must execute tasks in Cu process deposition engineering development across a wide range of technology development projects, working side-by-side with a diverse group of process engineers; expected to establish and maintain advanced metal deposition/fill processes for CMOS scaled interconnect and TSV, to interact with liner/seed and CMP process groups, and to understand, define and eliminate process related defects.

Minimum Qualifications:
A Bachelor’s degree in Chemical Engineering, Materials Science, or equivalent Engineering and/or Science related discipline from a college or University accredited by the US Department of Education or internationally recognized accrediting organization AND a minimum of 7 years experience working in the semiconductor industry as a Process Development Engineer in one or more areas of advanced metallization.

OR A Master’s degree in Chemical Engineering, Materials Science, or equivalent Engineering and/or Science related discipline from a college or University accredited by the US Department of Education or internationally recognized accrediting organization AND a minimum of 5 years experience working in the semiconductor industry as a Process Development Engineer in one or more areas of advanced metallization.

OR A Ph.D in Chemical Engineering, Materials Science, or equivalent Engineering and/or Science related discipline from a college or University accredited by the US Department of Education or internationally recognized accrediting organization AND a minimum of 2 years experience working in the semiconductor industry as a Process Development Engineer in one or more areas of advanced metallization.

Candidate must have a good understanding of BEOL integration; good oral and written communication skills; exhibit solid leadership ability; have familiarity with SPC/DOE methodologies; be willing to execute a variety of tasks on short notice; must have good program management and customer interface skills; knowledge of MS Office, DOE, and yield/defectivity analysis software.

CNSE is a multi-client, consortium environment, and the successful individual must demonstrate excellent communication, interpersonal, and organizational skills. Ability to work well under pressure and in a fast-paced environment is a must. Candidates must address in their applications their ability to work with culturally diverse populations.

This position is contingent on the satisfactory completion of a
background investigation; this position may be subject to annual
background investigations.

Notes: Employment is through The Research Foundation and is contingent upon continued funding. Salary is dependent upon experience. The Research Foundation of SUNY offers a competitive salary and exceptional fringe benefit package.

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