Ability to learn to operate a variety of microelectronic production equipment. Ability to read and follow process plans and work in a team environment.
Ability to obtain solder certification. Desired skills Ability to set up, operate and adjust a variety of microelectronics production equipment used to perform required operations and test on production runs of microelectronic devices/wafers. Additionally set up and operates manual, semi-automatic and automatic equipment and semi automatic and automatic test equipment. Specific Job Description 1) Works under direction and from production schedules, manufacturing procedures, process plans and written or oral instruction.
2) Perform a variety of routine tests on production runs of microelectronics parts using test fixtures and sort product using various instruments. Test equipment utilized is manual, semi-automatic and automatic or probe-set bench set up.
3) Operates and adjusts semi conductor die bond machine to bond die into packages per micro-circuit layout drawing. Requires careful handling for proper placement and alignment of dies. Requires the use of microscope and micro manipulators for precise control of die placement.
4) Loads and unloads components into burn in sockets and further loads those sockets into burn in ovens. Loads and unloads test units in test computers, test fixtures and automatic handlers
5) Operates and adjusts wire bond equpment to bond fine wires from components and packages to substrate metalized pads. Involves working to microcircuit layout drawings; incumbent is responsible for proper wire dress, bond appearance and bond strength.
6) Sets up and operates manual, semi-automatic and automatic equipment such as package sealers, screen printers, wire bonders, and other similar microelectronics fabrication equipment.
7) Checks product being fabricated/assembled for conformance to specifications and standard. Uses microscopes, leak detectors and other similar equipment which may require adjustment and involve a series of numerical and dial readouts and some interpretation.
8) Performs specified rework involving removal and replacement of components, removal and repair of wires and/or wire bonds.
9) Flexibility to be trained in multiple Microelectronics processes including those that require use of chemicals.
10) Manually solder surface mount and plated through hole components, clean, and inspect.
11) Visual acuity required to 20/20 correctable with a microscope, high level of manual dexterity, ability to lift 10 pounds minimum, basic computer skills and be able to pass production "A" type company administered physical. Read and interpret Engineering drawings.
12) Requires significant attention to detail for production activities and documentation to maintain compliance with Mil. Standard requirements.
Must have the ability to obtain a asecurity clearance and complete solder certification. Standard Job Description NA Security Clearance None Typical Minimums NA LMCareers Business Unit ESS0385 MISSILES AND FIRE CONTROL Business Area Electronic Systems Program Hellfire Department JME1:MEC Assembly Job Class Manufacturing Job Category Hourly/Non-Exempt City Orlando State Florida Relocation Available No Work Schedule 9x80A-9,9,9,9,8 hrs/d in wk1, /9,9,9,9,off in wk2 Req Type Full-Time Direct/Indirect Direct Shift First
Lockheed Martin Corporation - 2 years ago
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