US - NY - Endicott
This position will be a regular part-time position in our R&D area. This position is expected to work 20 hours per week. Part-time employees are not eligible for company benefits.
The R&D engineer will be a leader in the development of technology required for successful implementation of items within the thrust areas of EI’s electronic packaging technology roadmap.
These thrust areas include, but are not limited to, novel means of electrical interconnection, embedded actives, embedded/integrated passives, optoelectronics, materials (including nanomaterials), assembly, and high speed electronics. Applicant selected for this position will coordinate all technical activities related to a number of programs involving fabrication of specialized products and prototypes, specifically such products that require materials, processes, and/or equipment that are not within the standard menu for EI’s manufacturing areas. Applicant will devise process flows to build specialized products and prototypes, and generate quotations for customers based on these process flows.
Applicant should be knowledgeable (or will be trained) in the basics of construction and function of printed wiring boards and semiconductor packages. Applicant should be knowledgeable (or will be trained) in a number of process areas, in particular laser machining, lamination, vacuum deposition of metal films, photoresist processing, electroplating, and etching. Applicant should be skilled (or may be trained) in CAM design for purposes of creation, viewing, and/or modifying design data used for photolithographic artwork generation, laser machining, etc.
- Bachelor's in related field
- PhD preferred
Endicott Interconnect - 11 months ago