Senior Package Design Engineer Job
Micron Technology, Inc - Folsom, CA

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Job Description

As Senior Package Design Engineer with Micron Technology, you will provide package definition and designs for advanced semiconductor devices. You will be working with a cross-functional team across several geographies to create package design databases such as package stack-up, simulation, route-study, substrate/leadframe layout, wirebond diagrams, and other design documentation.

Responsibilities and Tasks

Design Coordination and Management

- Support feasibility studies for different package options.
- Interact with and support die design to enable silicon architecture development.
- Interact with key Business Unit stakeholders and recommend package solutions to meet customer and/or market requirements.
- Establish design gap analysis for subcontractor proposals.
- Support package technology development activities.
- Support packaging IP development.
- Provide design support for thermal/mechanical/electrical simulation analysis.
- Support the design group’s continuous improvement efforts.
- Support global design alignment activities.
- Contribute to package design rule and system development.
- Contribute to package roadmaps.
- Contribute to the Competitive Analysis review process.

Create Package Designs

- Support die padslog layout/optimization.
- Design for optimum electrical performance, manufacturability, and package reliability.
- Perform cross-functional team design reviews.
- Execute interposer supplier design reviews in a timely and efficient manner.
- Perform direct design reviews with assembly subcontractor design teams.
- Participate in the DFMEA process.

Generate Documentation

- Maintain familiarity with documentation work flows and signoff flows.
- Ensure accurate and timely update of all documents into the ARD.
- Check drawings from interposer suppliers, subcontractors, tooling vendors, etc., and provide input.
- Provide accurate information to the CAD group for the following drawings: Marketing Drawings, Manufacturing Drawings, Package Outline Drawings, Interposer Drawings, and WireBond Diagrams.

Contribute to a Safe and Compliant Work Environment

- Identify and promptly report hazards.
- Follow safety procedures and area work rule.
- Operate and maintain equipment and tools within manufacturer and company guidelines.
- Use proper lifting techniques and work in an ergonomically correct manner.



BS degree in engineering discipline or two year electronics degree


BS-MS in EE or ME



Eight years of semiconductor packaging experience in any of the following areas:

- Package design
- Assembly process
- Assembly materials
- Product Engineering
- Quality and Reliability


Ten years of work experience in either of the following areas:

- Package design
- Product Engineering


- Good computer skills and proficient in MS Office.
- CAD experience.
- Detail orientated.
- Strong oral and written communication skills.
- Ability to interact and work in a team environment.
- Fundamental electrical circuit knowledge.
- Ability to read and interpret drawings and schematics.
- Ability to prioritize and manage multiple projects.

About this company
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Micron Technology is one of the largest memory chip makers in the world. It makes DRAM (Dynamic Random Access Memory), NAND Flash, and NOR...