Senior Package Design Engineer Job
Micron Technology, Inc - Folsom, CA

This job posting is no longer available on Micron Technology, Inc. Find similar jobs: Senior Package Design Engineer jobs - Micron Technology jobs

Job Description

As Senior Package Design Engineer with Micron Technology, you will provide package definition and designs for advanced semiconductor devices. You will be working with a cross-functional team across several geographies to create package design databases such as package stack-up, simulation, route-study, substrate/leadframe layout, wirebond diagrams, and other design documentation.

Responsibilities and Tasks

Design Coordination and Management

- Support feasibility studies for different package options.
- Interact with and support die design to enable silicon architecture development.
- Interact with key Business Unit stakeholders and recommend package solutions to meet customer and/or market requirements.
- Establish design gap analysis for subcontractor proposals.
- Support package technology development activities.
- Support packaging IP development.
- Provide design support for thermal/mechanical/electrical simulation analysis.
- Support the design group’s continuous improvement efforts.
- Support global design alignment activities.
- Contribute to package design rule and system development.
- Contribute to package roadmaps.
- Contribute to the Competitive Analysis review process.

Create Package Designs

- Support die padslog layout/optimization.
- Design for optimum electrical performance, manufacturability, and package reliability.
- Perform cross-functional team design reviews.
- Execute interposer supplier design reviews in a timely and efficient manner.
- Perform direct design reviews with assembly subcontractor design teams.
- Participate in the DFMEA process.

Generate Documentation

- Maintain familiarity with documentation work flows and signoff flows.
- Ensure accurate and timely update of all documents into the ARD.
- Check drawings from interposer suppliers, subcontractors, tooling vendors, etc., and provide input.
- Provide accurate information to the CAD group for the following drawings: Marketing Drawings, Manufacturing Drawings, Package Outline Drawings, Interposer Drawings, and WireBond Diagrams.

Contribute to a Safe and Compliant Work Environment

- Identify and promptly report hazards.
- Follow safety procedures and area work rule.
- Operate and maintain equipment and tools within manufacturer and company guidelines.
- Use proper lifting techniques and work in an ergonomically correct manner.

Education

Required:

BS degree in engineering discipline or two year electronics degree

Desired:

BS-MS in EE or ME

Experience

Required:

Eight years of semiconductor packaging experience in any of the following areas:

- Package design
- Assembly process
- Assembly materials
- Product Engineering
- Quality and Reliability

Desired:

Ten years of work experience in either of the following areas:

- Package design
- Product Engineering

Qualifications

- Good computer skills and proficient in MS Office.
- CAD experience.
- Detail orientated.
- Strong oral and written communication skills.
- Ability to interact and work in a team environment.
- Fundamental electrical circuit knowledge.
- Ability to read and interpret drawings and schematics.
- Ability to prioritize and manage multiple projects.

Micron Technology, Inc - 10 months ago - save job - block
Recommended Jobs
Sr. Network Engineer
DST Systems - El Dorado Hills, CA
DST Systems - 14 days ago

Sr Electrical/Firmware Design Engineer
- Sacramento, CA
CareerBuilder - 21 days ago

Senior Structural Engineer
WorleyParsons - Folsom, CA
WorleyParsons - 28 days ago
About this company
116 reviews
Micron Technology is one of the largest memory chip makers in the world. It makes DRAM (Dynamic Random Access Memory), NAND Flash, and NOR...