Crestron is the world's leading manufacturer of advanced media, control and automation systems, innovating technology and reinventing the way people live and work. Offering integrated solutions to control audio, video, computer, IP and environmental systems, Crestron streamlines technology, improving the quality of life for people in corporate boardrooms, conference rooms, classrooms, auditoriums, and in their homes. Crestron's leadership stems from its dedicated people who are committed to providing the best products, programs and services in the industry. This culmination of loyalty, devotion and innovation is what our dealers refer to as "The Crestron Experience."
Crestron is looking for a talented individual to fill the position of Senior SMT Process Engineer. This position is located at Crestron’s state of the art circuit board assembly plant in Cresskill, NJ (07647). You will be relied on to provide technical leadership and to be a strong engineering presence in our PCB operation. You will be an essential player in a dynamic process engineering team, filling a role that provides a challenging but rewarding career opportunity. This facility focuses on new products designs and engineering runs; you will have a strong influence on the quality and reliability of Crestron’s future products.
Responsibilities for the Senior SMT Process Engineer include:
•Develop SMT processing parameters of automated assembly equipment
•Optimize SMT process performance by utilizing engineering methods and experimentation
•Strong participation in DFM analysis of new circuit board designs relating to SMT production
•Develop relationships with PC board design engineers to influence positive change
•Collaborate daily with various groups as necessary, including production, quality and purchasing
•Develop and maintain work instructions for SMT processes, including post reflow inspection
•Conduct DOE for process improvement and defect/failure analyses and prepare required reports
•Establish benchmark reference for programming Equipment
•Identify mismatches between CAD data and SAP BOM reports
•Identify methods to increase throughput and maintain downstream expected quality levels
•Report receipts of materials not packaged or order-configured for automated placement
•Adhere to J-STD-020 for moisture sensitive components
•Utilization of X-ray inspection and optical inspection systems and scopes for process verification
•Participate in SMT stencils selection including fiducial and aperture requirements
•Introduce solder paste placement improvement process and maintain process log
•Strive to eliminate hand placement activities of SMT components at post placement
•Create visual operator inspection criteria for each job at pre-reflow
•Optimize and maintain reflow profiles and Mole reports for each new board assembly
•Maximize capability of AOI as an effective detection tool of SMT placement and soldering defects
•Modify process control based on defect reports from In-circuit test and Final Quality Audit
•Recommend future SMT equipment purchases and upgrades based on production constraints and long-term forecasts.
Skills and Education Requirements:
Skills and Education Requirements:
Qualified candidates will interview directly with Process Engineering Manager and required to meet the level of experience and education commensurate with the job.
•Bachelors of Science degree in engineering, EE or ME preferred. Master’s degree a strong plus.
•5+ years operational experience with SMT programming and process parameter development
•Working knowledge of IPC-A-600, IPC-A-610, J-STD-001
•A proven problem solver with technical decision making skills
•Knowledge of Microsoft Office required
•Knowledge of CAD is required
•Must possess excellent oral and written communications skills
•The ability to work in a collaborative team environment is a must
•Strong mechanical aptitude is beneficial
•Must be able to work in the U.S. without sponsorship
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