The College of Nanoscale Science and Engineering (CNSE, http://cnse.albany.edu/) is seeking applicants for the position of Surface Analysis Engineer to work in its 300mm semiconductor development facilities. This position will primarily support AES and XPS techniques within the metrology group, requiring advanced knowledge to provide analytical support for diverse nanoscience characterization problems from faculty, students and engineering staff. We anticipate increasing demand for failure analysis techniques to aid yield enhancement in advanced CMOS, fin FET processes and beyond. Therefore the successful candidate will also have the experience and ability to apply surface analysis techniques to advanced failure analysis problems.
Job duties include, but are not limited to: Day-to-day operation of modern AES and XPS instruments, detailed interactions with inline engineering and metrology staff to provide feedback on wafer processes, internal and external customer applications support and interaction with customer service engineers in maintaining equipment and coordination of new equipment qualification. Close interaction with lab-based metrology staff will be essential in directing physical analysis. The successful applicant must be able to interface effectively with fab operations, process maintenance, and semiconductor engineering professionals from client companies.
Familiarity with allied surface analysis and imaging techniques such as SIMS, FIB, TEM and AES are essential. Familiarity with FA techniques such as light emission microscopy (EMMI), IR or liquid crystal imaging, optical beam induced current (OBIC, OBIRCH) and electrical tests are highly desirable. The candidate must be detail oriented and be able to interact with engineers, students and other clients seeking characterization of advanced semiconductor processes; materials development and problem solving in a university environment. Other reasonable duties as assigned.
M.S. degree in Chemical Engineering, Materials Science, Physics, or equivalent Engineering and/or Science discipline from a college or University accredited by the USDOE or internationally recognized accrediting organization AND 5-7 years experience working in the semiconductor industry as a Metrology Engineer in one or more areas of defect or films-based metrology.
OR Ph.D in Chemical Engineering, Materials Science, Physics, or equivalent Engineering and/or Science discipline from a college or University accredited by the USDOE or internationally recognized accrediting organization AND 2-4 years experience working in the semiconductor industry as a Metrology Engineer in one or more areas of defect or films-based metrology.
Candidate must have good oral and written communication skills, exhibit solid leadership ability, be familiar with SPC/DOE methodologies, and be willing to execute a variety of tasks on short notice. Good program management and customer interface skills are essential. Knowledge of MS Office and graphical plotting software are strongly recommended. A good understanding of FEOL and BEOL integration is a plus.
Candidates must address in their applications their ability to work with culturally diverse populations. This position is contingent on the satisfactory completion of a background investigation; this position may require annual background investigations.
Notes: Position contingent on the availability of funding
College of Nanoscale Science and Engineering - 19 months ago