Technical Applications Engineer
HEICO 3 reviews - Fremont, CA

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Job Code :

Division :
3D Plus

Location :
Fremont CA US 94538

Job Type :
Full Time

Career Level :
Experienced (Non-Manager)

Education :
Bachelor's Degree

Category :

Job Description :
As a Technical Applications Engineer at 3D PLUS USA, a division of HEICO Electronic Technologies, which is a worldwide leader of Memory Modules for high reliability applications (Space, Aeronautics, high end Industrial), this role will serve as the primary technical contact for North American customers and our sales team . This position will be in charge of the customer technical support, mostly before the sale but possibly after as well. The goal will be to win design-ins (ensure that customers design their systems using our components). The location will be in our Silicon Valley office in Fremont, California. Responsibilities will include, but are not limited to : · Working with 3D Plus customers to attain design wins and qualifications of our products (memory products and other highly integrated digital products) in their applications. · Providing technical support to customers and the field sales force. Support includes applications advice, product recommendations, and technical problem resolution. · Preparing and updating technical documentation to support our customers. Documents will include marketing fliers, product specifications and technical PowerPoint presentations. · Surveying 3D Plus markets and competitors offers to provide benchmark (strength and weaknesses) analysis to the sales force. · Visiting customers to determine their needs for new products and/or features and win designs. · Working with factory engineering group to communicate customer needs for new standard products or custom SIPs. · Providing product training to the field sales force and the distribution sales people (3D PLUS reps network across US and Canada).

Job Requirements :
Education: · BSEE or MSEE .
Successful candidate for this position will have: · The ability to be extremely self-motivated. · The ability to take initiative and to work independently or in a team environment. · High drive level and ability to be proactive. · Excellent customer skills (presentations in front of 20-30 customers are very common). · 5 years (or more) electrical engineering, applications engineering, test engineering, or design experience which may include: o Working in the field as an Applications Engineer or in a customer-facing technical role. o Design and/or test experience in one or more key 3D PLUS market segments such as Memories (SRAM, DRAM, DDR, NOR and NAND Flash, EEPROM) , highly integrated FPGAs (Actel, Xilinx). This can include system design, debug and test. o Behavioral and electrical simulation of logic systems. o Working as an applications engineer for a semiconductor manufacturer. o Good knowledge of the high reliability applications (Space, Aeronautics, Military…) and the needs of such applications (screening and qualification flows, radiation hardness assurance). · Excellent English skills, both oral and written. · Ability to travel for initial training (in Paris, France where the main factory is located) and travel as needed, for customer visits and training (USA and Canada) up to 2 weeks per month.
  • Green Card holder or US citizen only.
Please, no phone calls or faxes will be accepted. 3D Plus USA is proud to be an EEO/AA/V/H employer. For additional information on HEICO Careers, visit us online at

About this company
3 reviews
Here's a HEICO haiku: HEICO companies/ Providing for jet engines/ In flight or on land. Its Flight Support Group, consisting of HEICO...