Job will primarily involve processing 2 inch InP wafers.
This may involve spinning photoresist onto wafer, transferring patterns to wafer from a mask using a manual contact mask aligner, depth/thickness measurement using Tencor, width measurement using CD tools, wet etching, dry etching, depositing dielectric using PECVD, depositing metals using ebeam evaporator, rapid thermal annealing (RTA) and lift-off operations.
The technician may also be required to perform product testing on company base test platform.
SKILLS & QUALIFICATIONS:
At least 2 years of hands-on experience working in a wafer fab or Test lab.
At least 2 years of experience using metrology tools to measure width, depth and thickness.
At least 6 months of experience with process equipment such as e-beam evaporators, RTA, RIE, PECVD.
At least 6 months of experience with semiconductor test platforms.
Ability to handle fragile wafers.
Familiarity with SPC required.
Knowledge of basic math.
Ability to work with a microscope.
Basic communication skills
Ability to send emails and notify Manager and process Engineers when any issues are observed.
Training Requirements: Follow written documents and verbal instructions for each operation required.
Finisar - 21 months ago