Candidate will be responsible for improving yield and device performance of advanced logic devices during all phase of product life cycle including process development, production ramp, and high-volume manufacturing.
Responsibilities include working with semiconductor foundries to:
Identify sources of yield fallout
Reduce defect densities
Diagnose and resolve process excursions
Enhance transistor performance
Reduce process variation
This role requires interfacing with process development teams, product and test engineers, quality engineers, and procurement specialists. Good communication, teamwork, and analytical skills are required.
Minimum 7 years experience in process integration, device engineering, and/or process development. Hands-on work experience as a process, metrology, yield, or development engineer in wafer fab is a must. Knowledge of device physics, reliability failure mechanisms, and chemistry/physics of wafer fabrication processes are also required. Knowledge and practical use of statistical methods including SPC, DOE, and RSM, and statistical or yield analysis software such as JMP, DataPOWER, or Minitab is a plus.
Master's or Doctorate in Electrical Engineering, Physics, Materials Science, or related discipline required
QUALCOMM Incorporated, incorporated in 1985, designs, manufactures and markets digital wireless telecommunications products and services...