An experienced engineering technician is needed for the Physical Analysis Lab in the Technology Development group to handle high volume FIB and TEM imaging, as well as advanced FIB circuit edits. Hands on experience with FIB & TEM sample preparation techniques and imaging, along with good analytical skills are desired. Familiarity with typical semiconductor process integration will be helpful in interpreting process defects, and aid in providing analysis on cross sections with the ability to identify metal/intermetal dielectric layers and other device features. A focus on quality outputs is very important. Some knowledge of EDX and deprocessing techniques will also be helpful. Good teamwork and oral/written communication skills are essential along with the ability to interact well with other engineers about the details and status of imaging requests.
Job Requirements :
Some college course work or equivalent experience
Good communication skills
Offer Relocation :
Microchip Technology - 3 years ago