Graduate Intern in Electrical or Materials Engineering
Job Description: 3D modeling of analog devices.
Developing 3D models of solid state analog devices incorporating physical and electrical properties across a wide spectrum of operating conditions, film properties and configurations.
Externship to take place at Intel's Fab 17 facility in Hudson, MA. This site is approximately 30 miles west of MIT.
Job assignment is 3-6 months in duration
Candidate in Material Science or Electrical Engineering preferred with experience modeling analog devices in 3D.
- Strong communication and teamwork skills
- Semiconductor fabrication experience preferred but not required
- Candidate needs to have a permanent unrestricted right to work
Nov 2, 2012
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.
No relocation provided for this requisition
We will accept applications/resumes until 60 days after posting date or earlier at Intel’s discretion. Intel invites people of all ages currently enrolled in an academic institution (or graduated within the last 18 months) to apply.
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