Undergrad Intern Non Technical
Responsible for delivering new labeling capabilities. Examples:
Actual projects will be determined by the Label Capability Leader depending on the candidate's qualifications and the business needs at the time of the internship.
- Components and Systems & Boards (S&B) labeling benchmarking analysis: Customer requirements, industry capabilities, competitor services, etc. Includes S&B Finish Good shipment label customer information requirements.
- Update components label specs (with MCG) and determine commonalities between components and S&B label specs and recommend consolidation
- Map out label types and systems throughout Intel (i.e. raw materials, vendor, carriers, 3PL, BLS, site services, etc) and recommend consolidation with components/S&B
- Explore 2D capabilities (including customer reqs)
Working on or achieved a Bachelors or Masters Degree in Supply Chain, Business, Information Systems, or similar degree.
Strong analysis, research, problem solving, communication/presentation, and documentation skills. Proficiency in MS Word and Excel are required. Experience with MS Powerpoint, systems analysis, data analysis, and information systems is highly desired but not required
Oct 22, 2012
Dec 31, 2012
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.
We will accept applications/resumes until 60 days after posting date or earlier at Intel’s discretion. Intel invites people of all ages currently enrolled in an academic institution (or graduated within the last 18 months) to apply.
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