Materials Intern Undergraduate - 707052
Intel - Phoenix, AZ

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Materials Intern Undergraduate - 707052 Description
As a materials engineering intern in MTD, you will work in a multidisciplinary team to design and execute laboratory experimentation to demonstrate proof of concept for new packaging materials technologies. Daily responsibilities may include operating lab mixers and equipment, preparing specimens for testing, interacting with testing laboratories within Intel, and documenting activities in a lab notebook. This internship will provide the candidate exposure to materials and packaging technologies employed by Intel for a variety of microprocessor applications.
Minimum Qualifications:
The candidate must be enrolled and working towards a B.S. degree in Chemistry, Polymer Chemistry, Chemical Engineering, or Material Science, or a related field.

Preferred Qualifications:
· Strong laboratory skills
· Hands-on experience using laboratory equipment for materials formulation including as a polymer kettle, mixing bowl, roll mill, planetary mixer, spin coater, rotoevaporator, and buchner filtration is preferred.
· Familiarity with design of experiments, material/polymer processing, material/polymer testing, and Microsoft Office software is preferred.
· The student should be able to work independently.
· Good communication and documentation skills are essential.
Job Category : Engineering
Primary Location : USA-Arizona, Phoenix

Full/Part Time : Full Time
Job Type : Student/Intern
Regular/Temporary : Temporary
Posting Date : Mar 8, 2013
Apply Before : Mar 9, 2014

Business Group As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities. Materials Technology Development (MTD) innovates and qualifies a wide range of microelectronic packaging materials including epoxy encapsulants, epoxy mold compounds, solder spheres, fluxes, solder pastes, thermal interface materials, adhesives, and heat spreaders.
Posting Statement : We will accept applications/resumes until 60 days after posting date or earlier at Intel’s discretion. Intel invites people of all ages currently enrolled in an academic institution (or graduated within the last 18 months) to apply.

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