Package Mechanical Modeling Engineer ( 11782386 )
Freescale Semiconductor - Austin, TX

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Freescale Semiconductor is the global leader in embedded processing solutions, supporting the automotive, consumer, industrial and networking markets. From microprocessors and microcontrollers to sensors, analog ICs and connectivity — our vital technologies are the foundation to the innovations that make our world greener, safer, healthier and more connected. For more than 50 years, Freescale has played an essential role in the evolution of embedded solutions, and we want you to be a part of our next half-century. Freescale is committed to attracting great people of all styles, thoughts, cultures and backgrounds. We are driven by a culture of ownership, teamwork, and results — an engagement worldwide of more than 18,000 employees.

The mission of the Technology Solutions Organization (TSO) is to contribute to Freescale's sustainable competitive advantage by driving innovation. Focusing on the areas of design technology, packaging technology and advanced circuits, TSO leverages innovation to accelerate time-to-market and enable high performance and quality products at a competitive cost.

TSO develops, sources and integrates advanced design environments and tools, libraries and engineering compute infrastructure that are foundational to Freescale's successful new-product introduction of leading-edge designs. Similarly, TSO designs the semiconductor packages for Freescale's broad product portfolio, and sources, develops and integrates new packages and assembly processes in support of product roadmaps. In advanced circuits, TSO takes the lead in developing advanced IP for use in Freescale's next-generation products. TSO also undertakes strategic planning for future innovation at Freescale, including long-term technology R&D investments to replenish our innovation pipeline.

Within Freescale’s Technology Solutions Organization (TSO), the Packaging Solutions Development group (PSD) is responsible for the implementation of packaging solutions for new product introduction and the development of new packaging technologies including Sensor and Analog Products, Automotive MCU Products and Microcontrollers. This posted position will report to the Package Modeling Development Manager within PSD responsible for mechanical modeling of electronic packages and will be located in Austin, Texas.

The Modeling Engineer will work in the PSD modeling group to perform mechanical simulations on microelectronic packages for product development and package technology development.

The modeling engineer will work with design engineers and use modeling results to define packaged products and may work with external customers supporting package performance.

The modeling engineer will be expected to translate design and development requests into models and communicate these results to define packaged product solutions.

The scope of this position is modeling and simulation of packages ranging from Analog to Digital Microcontrollers.



MS in Mechanical Engineering/ related with experience in modeling and simulation of semiconductor packaging or related field required. PhD is desired.

Capability of performing mechanical simulations is required.

Experience with FEM software ANSYS or ABAQUS is desired.

Understanding of automotive packaging environments, product thermal performance and mechanical reliability requirements is desired.

Experience in modeling fatigue and fracture of materials and interconnects is desired


Strong written and verbal presentation skills required.

Freescale Semiconductor - 14 months ago - save job - block
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Freescale Semiconductor Holdings I, Ltd. (Freescale) is engaged in the design and manufacture of embedded processors. In addition to its...