Graduate Intern Package FA
Job Description: Responsible for identifying and researching component failures to help packaging technology development and improve product yield, quality and reliability. Systematic EBSD study on microstructure/grain orientation and modulators, perform failure analysis and determine root cause, and recommend corrective actions. for problem fix.
You must possess the minimum qualifications to be initially considered for this position. Experience would be obtained through your educational level research and/or relevant job/internship experiences.
Candidates must be actively enrolled and currently pursuing a graduate degree program (MS/PhD) in Materials Science, Physics, Chemistry or related discipline.
· R&D experience in material characterization, microstructure/material behavior
· Skillful with SEM, EBSD
Feb 15, 2013
Mar 22, 2013
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.
We will accept applications/resumes until 60 days after posting date or earlier at Intel’s discretion. Intel invites people of all ages currently enrolled in an academic institution (or graduated within the last 18 months) to apply.
Intel - 13 months ago
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