Job Description: Candidate will be responsible for influencing the thermal design and technology of IC packages and associated components during the discovery, definition and development stages of technology maturity. Scope is to address all thermal aspects of the technology, including thermal interface materials, heat spreaders and their associated design, material and process interactions. Focus on thermal solutions for meeting increased demands for novel solutions across all market segments ranging from hand held devices and small form factor packages with constrained physical and thermal environments to higher power server products. Candidate will be responsible for the modeling and characterization of thermal response of the IC/Package and the thermal stack using thermal and flow analysis and measurement techniques.
A MS in Mechanical Engineering or a related discipline; PhD in Mechanical Engineering strongly preferred.
Candidate needs to have a strong background in thermal sciences with emphasis on both, analytical and measurement methods. Expertise required in the thermal and/or fluid flow analysis and measurements of IC packaging or related areas. Candidate must have experience in numerical techniques for thermal modeling and simulation such as computational fluid dynamics (CFD), finite difference/finite element approaches, etc. Exposure to commercial software such as ANSYS, FLUENT, FLOWTHERM and/or ICEPAK a definite plus. As part of the job function, candidate will also be expected to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.
Oct 21, 2012
Oct 22, 2013
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.
We will accept applications/resumes until 60 days after posting date or earlier at Intel’s discretion. Intel invites people of all ages currently enrolled in an academic institution (or graduated within the last 18 months) to apply.
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