DETD Graduate Engineering Intern (DE2) - 703807
Intel - Phoenix, AZ

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DETD Graduate Engineering Intern (DE2) - 703807 Description
This is an engineering internship in Intel's Die Embedding Technology Development facility on the Intel Chandler Campus in the Phoenix metropolitan area.
The internship could begin any time during the year and is designed for a duration of 3-6 months, during breaks from school.
Candidate must be a Graduate engineering students pursuing a M.S./Ph.D. in Materials Science, Chemical Engineering, Mechanical Engineering or Structural Mechanics.

Candidate must be enrolled in a graduate engineering program pursuing a M.S./Ph.D. in Materials Science, Chemical Engineering, or Mechanical Engineering.

Additional qualifications include:
- Strong engineering troubleshooting and analytical skills
- Good team participation skills
- Strong communication and teamwork skills
- Demonstrated verbal and written communication skills
- Comfortable presenting issues and solutions to multiple layers of management
- Must have the permanent and unrestricted right to work in the US without sponsorship from a company
- Should have 3.3 GPA or higher
- Should have at least one semester following internship prior to graduation

Job Category : Engineering
Primary Location : USA-Arizona, Phoenix

Full/Part Time : Full Time
Job Type : Student/Intern
Regular/Temporary : Temporary
Posting Date : Jan 21, 2013
Apply Before : Jan 22, 2014

Business Group As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities. Intel's Die Embedding Technology Development (DETD) organization is part of Assembly Test Technology Development (ATTD) and is located on the Chandler Campus in the Phoenix, Arizona metropolitan area. DETD is looking for individuals to join a new team tasked with starting up a pilot line to develop an internal Bumpless Build-up Layer (BBUL) Packaging process. This next generation packaging process represents the most fundamental shift in packaging since Intel moved to the C4 process 12 years ago
Posting Statement : We will accept applications/resumes until 60 days after posting date or earlier at Intel’s discretion. Intel invites people of all ages currently enrolled in an academic institution (or graduated within the last 18 months) to apply.

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