Process TD Engineer - 632374
Intel - Phoenix, AZ

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Process TD Engineer

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632374

Description

We are seeking for a highly motivated individual with a strong technical background and capabilities to develop and sustain process technologies for Module Engineering. In this position, you will be developing process and equipment for Intel Assembly to meet quality, reliability, cost, yield, productivity and manufacturability requirements and working in a highly matrixed environment interfacing with multiple development groups including Packaging Design, Manufacturing, Materials Development, Silicon Integration, Platform Integration, Equipment Development, and High Volume Manufacturing (HVM) factories.

Job Description: Plans and conducts experiments to fully characterize the process throughout the development cycle (pathfinding, discovery, definition, and development, and high volume manufacturing ramp). Drives improvements on quality, reliability, cost, yield, process stability and/or capability, productivity and safety and/or ergonomic over variables such as material, method, equipment, environment and operating personnel. Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Develops strategy to resolve difficult problems and establishes systems to deal with these problems in the future. Trains production and/or receiving process engineers for transfer to other factories. Transfers process to high volume manufacturing and provide support in new factory startup as well as install and qualification of the new production lines.

Qualifications

You must possess a Master's degree in Materials Science, Chemical or Mechanical Engineering or any electronic packaging related field.

Additional qualifications include:
  • Demonstrate knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles
  • Demonstrate experience of equipment skills and capable of driving improvements in equipment needed to deliver leading edge process capability
Preferred Skills:
  • Demonstrate experience and knowledge in semiconductor packaging process would be an added advantage
Job Category

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Engineering

Primary Location

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USA-Arizona, Phoenix

Full/Part Time

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Full Time

Job Type

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College Graduate

Regular/Temporary

:

Regular

Posting Date

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Jan 16, 2013

Apply Before

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Jul 1, 2013

Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.

Posting Statement

:

We will accept applications/resumes until 60 days after posting date or earlier at Intel’s discretion. Intel invites people of all ages currently enrolled in an academic institution (or graduated within the last 18 months) to apply.

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