Job Description: Candidate will be a member of the Mechanical Core Competency group in ATTD performing analysis, validation and characterization of structural integrity risk assessments and solutions for packaging, assembly and test technologies. Candidate will be responsible for influencing the design, materials selection, and structural integrity of high performance IC packages and other associated components and collaterals under assembly and test processes and usage conditions. Focus will be on study of electronic package and die behavior under thermo-mechanical loading, development of new/novel metrologies for the same, material property characterization, and model validation. The ideal candidate is very hands-on, self-motivated, proficient in technical problem solving, a team player, and able to influence others.
You must possess the minimum qualifications to be initially considered for this position. Experience would be obtained through your educational level research and/or relevant job/internship experiences.
PhD in Mechanical Engineering, Applied Mechanics, Materials Science, or a related discipline.
· The candidate should have experience in mechanical testing, characterization methods and tools.
· Candidate needs to have 'hands-on' experience in the characterization / validation of structural behavior under thermo-mechanical loading using one or more of the following methods:
o Opto-mechanical testing techniques (Moire, Interferometry, Digital Image Correlation, etc.)
o Sensor based methods (load cell, strain gage, thermocouple, etc.)
o Commercial mechanical testing equipment such as MTS/Instron
· Knowledge in fracture mechanics, adhesion strength testing, nano-indentation, reliability and failure analysis of electronic packages, and LabView programming is a plus.
Feb 15, 2013
Feb 16, 2014
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.
We will accept applications/resumes until 60 days after posting date or earlier at Intel’s discretion. Intel invites people of all ages currently enrolled in an academic institution (or graduated within the last 18 months) to apply.
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