The Advanced Imagers and Silicon Technology Group is in need of Etch Process Engineer. This individual will work in the Class 10 Clean Room of the Microelectronics Laboratory supporting a broad range of activities in the Advanced Technology Division including, but not limited to, deep sub-micron CMOS devices for low-power applications and 3D integration, innovative silicon-based focal plane devices for DoD and scientific applications, niobium-based superconducting circuits for quantum computing, and microfluidic structures for biological and chemical applications.
Candidate will be responsible for the etch area in the Microelectronics Laboratory. They will be the point of contact for all etch-related issues for technicians, technical staff, specialists, engineers, and facilities.
The ability to demonstrate effective communication skills are necessary, as this role will interface with all levels of staff. He or she will also be required to keep others informed of status of tools and projects, as well as creating/maintaining documentation, especially supporting trusted foundry standard operating procedures. They will also be responsible for management of resources within the etch area, to optimize efficiency and throughput of quality yields.
In this role, they will also define, improve, maintain, and monitor baseline processes and tools, proactively improving process stability, productivity, yield, reliability and safety. Statistical process control monitoring and analysis/response will be an important tool in this role. In addition to supporting the baseline processes, the candidate will drive and support others in new process development.
The candidate must be able to demonstrate flexibility in responding to rapidly changing environments and priorities, as the Lab does both production and development for multiple projects simultaneously. Understanding of the broader view goals, effective planning and communication and personal skills are essential in order to effectively and efficiently address the most urgent and highest priorities.
•BS degree, in Electrical Engineering, Material Science, Chemical Engineering, Physics or related field.
•Extensive experience in the semiconductor industry. Minimum of five years plasma etching experience is required.
•Specific experience with Applied Materials DPS and eMax plasma etch systems is highly desirable. In depth equipment, hardware, and software knowledge/understanding (e.g. vacuum systems, plasma reactors, mfc's)
•Process knowledge of plasma etching including Polysilicon, Silicon Dioxide, Aluminum and Silicon Nitride.
•Motivated self-starter who can aggressively and independently work on process support activities and projects to a successful completion with little or no supervision.
•Knowledge of various metrology tools such as Ellipsometer, 4pt probe, Surfscan, SEM, KLA would be beneficial.
•Demonstrate working knowledge of statistical analysis and design of experiments.
•Must have excellent written and verbal communication skills.
•Experience defining and implementing statistical process control to monitor and improve wafer fabrication processes.
MIT Lincoln Laboratory - 16 months ago
MIT Lincoln Laboratory, headquartered in Lexington, MA, is a U.S. Department of Defense research and development center chartered to apply...