Conduct detailed mechanical and thermo-mechanical simulations on various package types to characterize and optimize product mechanical design and material selection.
Mechanical simulations and Analyses include but not limited to
-Package warpage prediction at various temperatures
-Package and board level reliability prediction for temperature cycle and drop/shock condition
-Mechanical stress analysis for external load applications
-Linear and non-linear analysis with creep and viscoelastic material behavior
Develop detailed finite element parametric models using ANSYS APDL for various package types such as CSPs, WLCSPs, BGAs, FCBGAs, QFNs, and Package-on-Package
Collaborate with internal design, advance packaging and technology, NPI, and customer facing teams and provide timely support to these teams.
Mechanical simulations, data analysis and interpretation, communications with internal and external customers and suppliers
-Minimum of 2 years of experience in Mechanical Simulations IC package technologies using ANSYS finite element analysis software. Relevant research work at Masters and PhD level can be considered in lieu of industry experience
-Strong knowledge of ANSYS APDL language for parametric model development
-Working knowledge of Autocad, SolidWorks, LabView, Gerber/PCB design
-Effective communications skills
Required: Master's, Materials Science and/or Mechanical Engineering or equivalent experience
Preferred: Doctorate, Materials Science and/or Mechanical Engineering or equivalent experience
QUALCOMM Incorporated, incorporated in 1985, designs, manufactures and markets digital wireless telecommunications products and services...