As part of the HSWP (High-Speed Wired Peripheral) organization within QCT, you will be responsible for bench characterization of Digital High-Speed Physical Layer SERDES (USB, SATA, PCIe, MIPI PHY , HDMI). Our goal/mission is to ensure that our products are manufacturable, and exceed the performance expectations of our global customers.
Candidate must be proficient in test/characterization of High-Speed SERDES (USB, SATA, PCIe, MIPI, HDMI) on custom bench test platforms. Position requires a working knowledge in the areas of board design, transmission line theory, High-Speed signal integrity, de-embedding, and port extension. Hands on knowledge of oscilloscopes, network / spectrum analyzers, signal generators, and logic analyzers is a must; experience with Agilent test equipment a plus. Software programming skills must include C-Sharp (or equivalent) and LabView. Position requires the ability to work with cross-functional teams, and candidate must have excellent communication skills.
Preferred: MSEE with 3+ yrs experience
Minimum: BSEE 5+ yrs experience
Qualcomm - 2 years ago
QUALCOMM Incorporated, incorporated in 1985, designs, manufactures and markets digital wireless telecommunications products and services...