Materials Analysis Engineer - 700812
Intel - Hillsboro, OR

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Materials Analysis Engineer

-

700812

Description

As a Materials Analysis Engineer, you will be part of Technology Development Labs responsible for identifying and developing materials characterization and failure analysis techniques in support of Intel's next generation silicon process development. The candidate must work in concert with Process Development and Quality & Reliability Engineers to enable robust failure rate models and risk assessments of the silicon processes under development to improve process performance, product yield, quality and/or reliability. The scope may include wafer and unit level Front-end Module, Back-End/Far Back-End Modules.

Your responsibilities will include but are not limited to:
  • Implementing materials characterization techniques to determine fundamental thin film material properties and correlates these properties with integrated process technology to improve process performance and reliability.
  • Analyzing failure reports and recommending corrective action to prevent reoccurrence of problems.
  • Supporting new process/product transfer and startup and the automation and improvement of the failure analysis process.
  • Ensuring that materials/failure analysis capabilities needed to support advanced process technology and/or product development are in place. May necessitate the development of improved/new tools and methods.
  • Collaborating with device and process development engineers to determine the relationship of materials properties to electrical performance and quality/reliability engineers to assist in risk assessment.
Qualifications

Minimum Qualifications:
Master of Science degree in Materials Science, Chemistry, Physics, Chemical Engineering or related discipline.

Preferred Qualifications:
  • Hands on experience with chemical analysis and/or imaging using equipment such as magnetic sector or Time-of- Flight SIMS, SEM, DIB, TEM, and EDX/EELS.
  • Prior Intel Intern or Scholarship recipient
  • Experience with statistical packages e.g. JMP or Minitab
  • Experience in one or more of the following areas: thin film process deposition and characterization, semiconductor device physics, interconnect reliability, reliability statistics.
  • Knowledge of semiconductor fabrication, test and/or assembly packaging processing and associated materials.
Job Category

:

Engineering

Primary Location

:

USA-Oregon, Hillsboro

Full/Part Time

:

Full Time

Job Type

:

College Graduate

Regular/Temporary

:

Regular

Posting Date

:

Jan 3, 2013

Apply Before

:

Apr 1, 2013

Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.

Posting Statement

:

We will accept applications/resumes until 60 days after posting date or earlier at Intel’s discretion. Intel invites people of all ages currently enrolled in an academic institution (or graduated within the last 18 months) to apply.

Intel - 21 months ago - save job - block
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