Job Category: Hardware Engineering
Location: Redmond, WA, US
Job ID: 803274-86467
Division: Windows Division
Are you passionate about building cool devices and technologies? The Surface Team focuses on building devices that fully express the Windows vision. A fundamental part of our strategy is having desirable and powerful devices that enable the experiences people want, and elicit their excitement. Creating these devices involves a close partnership between hardware and software engineers, designers, and manufacturing. We are currently building the next generation and Surface needs you!
Role & Opportunity:
We are looking for a Senior Thermal Design and Analysis Engineer who is charged-up by leading system-level and sub-system thermal analysis on electronic products through fast-paced product development cycles. A strong mix of technical breadth and vision allow you to work cross-functionally to develop passive and active cooling thermal designs that best balance performance, cost, manufacturability, acoustics and reliability. You are highly motivated and enjoy bringing technical and tactical leadership to cross-disciplinary teams.
An ability to manage complex projects and design rigor against development timeline needs is required, and your excellent communication skills allow you to work seamlessly with teams across various engineering functions and geographies. As such, you are willing to travel internationally at times to support design and manufacturing activities. You must be able to work well with international contract manufacturers.
Additional Responsibilities include:
Provide analytical design and analysis of systems using tools such as ICE PACK or FLOW THERM directly or through onsite contractor support.
Provide direction and input for empirical test designs to validate the analytical analysis, these include thermal load board, wind tunnel, hot plate, thermal transit, etc and to help manage the construction and testing of these test vehicles, either internally or outsourced to sub-contractors.
Write thermal component design and test specifications and validate and document compliance with these specifications both via internal and outsourced testing. Develop, conduct and manage all empirical testing via thermal load boards and full function development and retail systems running software programs that exercise the system power levels. Conduct and manage system level thermal mapping and IC thermal corner study testing plus thermal reliability and assist in mechanical environmental testing validation as it relates to thermal performance.
Include ongoing cost reduction and multiple supplier testing as well as design improvement recommendations and validation. Direct interface with many different suppliers will be required. Staying abreast of current and developing thermal solution technology activity will also be the responsibility of the engineer.
Experience with accelerated test methodologies (Halt, Strife, Ret, etc), Finite Element Analysis (FEA) is preferred.
B.S. in mechanical engineering or related engineering field with a minimum of four years of directly related experience in electronics industry or similar.
Excellent communication and teamwork skills.
Ability to travel internationally.
MS or PhD in Mechanical Engineering with an emphasis on System Thermal Design or Heat Transfer.
Mechanical design capability and experience in a common CAD package such as ProE or SolidWorks.
Experience with manufacturing, thermal components supply chains and cross-communications between design, ODM and third party vendor teams.