Senior Process TD Engineer
Job Description: Defines roadmaps to meet requirements, goals and milestones for a new technology process. Defines and establishes flow, procedures, and equipment configuration for the module. Selects and develops material and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Plans and conducts experiments to fully characterize the process throughout the development cycle. Drives improvements on quality, reliability, cost, yield, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel. Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Establishes process control systems for the process module and sustains the module through volume ramp. Develops strategy to resolve difficult problems and establishes systems to deal with these problems in the future. Trains production/receiving process engineers for transfer to other factories. Transfers process to high volume manufacturing and provide support in new factory start-up as well as install and qualification of the new production lines.
You must possess the minimum qualifications to be initially considered for this position. Experience would be obtained through your educational level research and/or relevant job/internship experiences.
Ph.D. in Materials Science, Chemical, Mechanical Engineering or any other electronics packaging related field.
- Hands-on Cleanroom (process and equipment) experience
- Prior internship experience or collaborated Ph.D. thesis in a packaging related industry preferred
- Ability to lead and influence both external and internal teams, and work independently without much supervision
- Demonstrate experience of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles
Nov 13, 2012
Mar 31, 2013
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly packaging. Employees in the Technology and Manufacturing group are part of a worldwide network of manufacturing and assembly/test facilities.
We are seeking for a highly motivated individual with a strong technical background and capabilities to develop and sustain process technologies for Intel Assembly. In this position, you will be developing process and equipment for Intel assembly to meet quality, reliability, cost, yield, productivity and manufacturability requirements and working in a highly matrixed environment interfacing with multiple development groups including Packaging Design, Manufacturing, Materials Development, Silicon Integration, Platform Integration, Equipment Development and 24/7 High Volume Manufacturing (HVM) factories.
We will accept applications/resumes until 60 days after posting date or earlier at Intel’s discretion. Intel invites people of all ages currently enrolled in an academic institution (or graduated within the last 18 months) to apply.
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