Conduct detailed mechanical and thermo-mechanical simulations on various package types to characterize and optimize product mechanical design and material selection.
Mechanical simulations and Analyses include but not limited to
-Package warpage prediction at various temperatures
-Package and board level reliability prediction for temperature cycle and drop/shock condition
-Mechanical stress analysis for external load applications
-Linear and non-linear analysis with creep and viscoelastic material behavior
Develop detailed finite element parametric models using ANSYS APDL for various package types such as CSPs, WLCSPs, BGAs, FCBGAs, QFNs, and Package-on-Package
Conduct and coordinate mechanical test for material properties and mechanical behavior. Define DOEs and test plans and work with package characterization and applications lab.
Correlate and calibrate simulation results with actual warpage and reliability data.
Collaborate with internal design, advance packaging and technology, NPI, and customer facing teams and provide timely support to these teams.
Mechanical simulations, material and mechanical testing, data analysis and interpretation, communications with internal and external customers and suppliers
Minimum of 5-10 years of experience in Mechanical Simulations IC package technologies using ANSYS finite element analysis software
Expert knowledge of ANSYS APDL language for parametric model development
Strong skills and understanding of creep and viscoelastic behavior of materials and simulation techniques for such materials
Hands-on experience in mechanical and material testing including Instron, DMA, and TMA
Strong written and oral communications skills
Working knowledge of Autocad, SolidWorks, LabView, Gerber/PCB design
Required: Master's, Materials Science and/or Mechanical Engineering or equivalent experience
Preferred: Doctorate, Materials Science and/or Mechanical Engineering or equivalent experience
Qualcomm - 22 months ago